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化学镀钴-镍-磷合金镀层沉积速度的探讨
引用本文:宣天鹏,卑多慧.化学镀钴-镍-磷合金镀层沉积速度的探讨[J].电镀与涂饰,2000,19(2):6-9.
作者姓名:宣天鹏  卑多慧
作者单位:合肥工业大学,材料科学与工程学院,安徽,合肥,230009
摘    要:化学镀钴-镍-磷合金镀层具有良好的磁学性能,正日益受到人们的青睐。由于沉积速度往往对镀层性能产生很大影响,在此重点了影响化学镀钴-镍-磷合金镀层沉积速度的各因素。结果表明,提高镀液中金属离子总浓度及镍盐所占的比例,在PH为8 ̄10范围内加入适量的稳定剂及采用活性强的基材有利于化学镀钴-镍-磷合金镀层沉积速度的提高。

关 键 词:化学镀  沉积速度  钴镍磷合金  镀层  电镀

Study of the deposition rate of cobalt-nickel-phosphorus alloy
XUAN Tian-peng,BEI Duo-hui.Study of the deposition rate of cobalt-nickel-phosphorus alloy[J].Electroplating & Finishing,2000,19(2):6-9.
Authors:XUAN Tian-peng  BEI Duo-hui
Abstract:Electroless cobalt-nickel-phosphorus deposits are becoming increasingly popular for their good magnetic properties. It proved that deposition rate usually has great influence on coating properties, emphasis was placed on the investigation of deposition rate-affecting factors in electroless cobalt-nickel-phosphorus alloy plating process. The results indicate that deposition rate of cobalt-nickel-phosphorus increases with the increase of total metal ion concentration and nickel ratio in the plating bath, in addition, within the pH value of 8 and 10, proper amount of stabilizer and substrate with high active surface are also good for the increase of electroless deposition rate.
Keywords:elelctroless plating  cobalt-nickel-phosphorus  deposition rate  
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