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溶胶-凝胶法在3D-SiC陶瓷表面浸涂Al_2O_3薄膜的研究
引用本文:闫海乐,茹红强,喻亮,里景阳,魏文韬,岳新艳.溶胶-凝胶法在3D-SiC陶瓷表面浸涂Al_2O_3薄膜的研究[J].材料导报,2009,23(22).
作者姓名:闫海乐  茹红强  喻亮  里景阳  魏文韬  岳新艳
作者单位:东北大学材料与冶金学院材料各向异性与织构教育部重点实验室,沈阳,110004
基金项目:国家自然科学基金,全国大学生创新性实验计划 
摘    要:以无机盐Al(NO_3)_3·9H_2O为先驱体、水为溶剂,加入不同浓度的胶溶剂HNO_3,采用溶胶-凝胶(Solgel)法制备了勃姆石(γ-AlOOH)溶胶.分别以溶液下降法和真空浸渍法在三维网络碳化硅陶瓷骨架(3D-SiC)表面浸涂γ-AlOOH溶胶,采用不同烧结制度在3D-SiC表面生成了Al_2O_3薄膜.采用X射线衍射仪(XRD)、红外光谱仪(IR)和扫描电子显微镜(SEM)分析了薄膜的物相和显微结构,并检测了薄膜的抗热震性.结果表明,采用真空浸渍法在3D-SiC表面浸涂加入浓度0.22mol/L HNO_3制备的γ-AlOOH溶胶能烧结形成致密平整的Al_2O_3薄膜.升高烧结温度,Al_2O_3晶粒长大,900℃时薄膜最致密且能观测到玻璃态显微结构.薄膜的抗热震性随烧结温度升高而提高.

关 键 词:溶胶-凝胶法  真空浸渍法  薄膜  三维网络碳化硅  抗热震性

Research of Al_2O_3 Film on the Surface of 3D-SiC Ceramics by Sol-gel Method
YAN Haile,RU Hongqiang,YU Liang,LI Jingyang,WEI Wentao,YUE Xinyan.Research of Al_2O_3 Film on the Surface of 3D-SiC Ceramics by Sol-gel Method[J].Materials Review,2009,23(22).
Authors:YAN Haile  RU Hongqiang  YU Liang  LI Jingyang  WEI Wentao  YUE Xinyan
Abstract:The preparation process of Al_2O_3 thin film is represented by the sol-gel method, in which Al(NO_3)_3·9H_2O is used as precusor, water and HNO_3 as solvent and peptizing agent, respectively. Dip-coating and vacuum impregnation methods are used to coat γ-AlOOH sol solution on three-dimensional silicon carbide sintered at different temperature to form Al_2O_3 thin film. X-ray diffraction(XRD), infrared spectrometry(IR), scanning electronic microscope(SEM) are used to study the mierostrueture and phase constitution of the film. The investigation clearly shows that the thin film which prepared from γ-AlOOH sol solution added 0.22mol/L HNO_3 with vacuum impregnation method, is coated on three-dimensional silicon carbide perfectly. The grain of Al_2O_3 increases with the sintering temperature increasing. The thin film is full density at 900℃, and the glass microstructure is observed. The thermal shock resistance of the Al_2O_3 thin film increases with the sintering temperature increasing.
Keywords:Al_2O_3  Sol-gel method  vacuum impregnation method  Al_2O_3 thin film  three-dimensional silicon carbide  thermal shock resistance
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