| Abstract: | A new thermosyphon cooling module (TSCM) has been designed, fabricated and tested to cool the multi-chip module plugged into a planar packaging system. The cooling module consists of a cold plate and an integrated condenser. With an allowable temperature rise of 56°C on the surface of the heater, the cooling module TSCM can handle a heat flux of about 2.7 W/cm2 using R11 as working fluid. The transient characteristics of the cooling module have been proved to be excellent: that is, when a heat load is applied inside of the system, steady state can be achieved within 10 to 15 minutes. It has been found that the length of the vapor channel between the cold plate and the condenser in addition to the ambient and the condenser temperatures affect the system performance. |
