Aktuelle Entwicklungen in der Zühtungstechnologie von CZ‐Si‐Kristallen

Current Developments in CZ Si Crystal Growing Technology The industrial growing of increasingly large and perfect silicon (Si) monocrystals for applications in microelectronics and photovoltaics requires continuous improvement of process control and growing technology. Continuous adaptation and optimization of system technology in terms of reliability, process flexibility and dimensioning are also necessary. The basic principles of industrial silicon crystal growing and the resultant requirements for the Si process andsystem technologies are described in the first part of this series of articles. The constantly increasing requirements for the performance and complexity of the electronic circuits (chips) in accordance with Moore's Law mean that the requirements for the perfection and dimensions of monocrystalline Si wafers and Si crystals are also continuously rising. After the introduction of the 300 mm Si wafer generation in recent years, the next Si wafer generation (450 mm) is therefore being discussed already. The technological and economic effects of these constantly increasing requirements for the necessary system technologies will be set out and discussed in the subsequent articles on the basis of current Si CZ crystal growing systems as well as new system concepts.