环氧树脂灌封材料的研究进展

简述了环氧树脂胶粘剂几种典型的增韧改性机理,包括橡胶类增韧剂增韧机理、塑性树脂形成半互穿网络结构增韧机理、改变交联网络的化学结构增韧机理以及控制分子链交联网络状态的不均匀性来改进环氧树脂增韧机理等,介绍了以上机理在液晶环氧树脂、氰酸酯树脂改性环氧树脂以及纳米离子改性环氧树脂中的具体应用,提出了环氧树脂的应用发展方向主要体现在低粘度化和提高耐热性、降低吸水率2个方面,最后简要说明了环氧树脂胶粘剂的使用注意事项.

Research Evolvement in Epoxy Resin Encapsulation Material

Several typical toughening and modification mechanisms of the epoxy resin adhesive are summarized. Including the toughening mechanism of rubber toughener, the toughening mechanism that plastic resin forms semi IPN structure, the toughening mechanism that can change chemical structure of cross-linked network and the toughening mechanism that can improve the epoxy resin under the circumstance of controlling the heterogeneity for the crosslinked network of molecular chain and so on. The above mechanism's specific application is introduced in respect of liquid crystalline epoxy resin, the epoxy resin modified by cyan ate resin and the epoxy resin modified by Nanion. The application and development trend of the epoxy resin are put forword, which embody mainly in the two respects of low viscosity, improving heat-resistance and reducing water absorption rate. Finally, a brief explanation is given for using precautious particulars of the epoxy resin adhesive.