玻璃-莫来石陶瓷复合材料基板的研究

以低介电常数的玻璃粉末和莫来石粉末为原料,制备了玻璃–莫来石陶瓷复合材料基板。研究了烧结温度和莫来石含量对复合材料的介电性能和抗弯强度的影响。结果表明,当莫来石质量分数为50%时,玻璃–陶瓷复合材料经1 000℃、2 h的烧结后,其相对介电常数er为4.6、介质损耗tgd 为0.008、抗弯强度s 为90 MPa。另外,该复合材料在200~600℃之间的热膨胀系数约为4.0×106℃1,与Si、GaAs等半导体材料的热膨胀系数相近,可望作为优质封装材料应用。

Study of Glass-mullite Ceramic Composite Substrate

The glass-mullite ceramic composite substrate have been prepared in the paper, using glass powder with low dielectric constant and mullite powder as starting materials. The effect of the sintering temperature and the mullite content on the dielectric properties and the bending strength has been studied. The results show that when the mullite content is 50%, the relative dielectric constant reaches 4.6, the dielectric loss reaches 0.008 and the bending strength reaches 90 MPa after the glass-mullite composite material are sintered for 2 h at the temperature of 1000℃. The thermal expand coefficient of the composite material,similar to Si or GaAs semiconductor, is about 4.0×106℃1 in the temperature range of 200~600℃,so it can be used as good package materials.