| 施镀工艺参数对化学镀沉积速率的影响 |
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| 引用本文： | 张邦维,谢浩文.施镀工艺参数对化学镀沉积速率的影响[J].电镀与环保,1999,19(5):15-22. |
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| 作者姓名： | 张邦维 谢浩文 |
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| 作者单位： | [1]湖南大学应用物理系 [2]长沙交通大学计算机系 |
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| 摘 要： | 各种工艺参数对化学镀沉积速度影响的研究是化学镀中的关键问题之一，文献尚无系统的研究，本文全面总结研究了金属盐浓度，还原剂浓度，络合剂浓度，ＰＨ值，施镀温度与时间对化学镀沉积速度的影响和原因。
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| 关 键 词： | 化学镀 沉积速度 工艺参数 电镀 施镀 |
Effects of Plating Process Parameters on Electroless Deposition Rate |
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| Abstract: | Effects of metalic salt concentration, reducing agent concentration, complexing agent concentration, pH value, plating temperature and time on electroless deposition rate are thoroughly investigated and summed. In general, with increase of concentrations of metallic salt, reducing agent and complexing agent, and pH, deposition rate is firstly increased and decreased after max. values are reached; with rising of bath temperature, plating rate will be increased and plating can not be conducted any more after definite values are reached; while with time lengthened, rate can only be reduced. Phenomena without following such general laws are analyzed. |
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| Keywords: | Electroless Deposition rate Parameter |
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