| 用Ti/Ni/Ti多层中间层进行Si_3N_4陶瓷的部分瞬间液相连接 |
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| 引用本文： | 陈铮,赵其章,楼宏青,周飞,李志章,罗启富.用Ti/Ni/Ti多层中间层进行Si_3N_4陶瓷的部分瞬间液相连接[J].硅酸盐学报,1998(1). |
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| 作者姓名： | 陈铮 赵其章 楼宏青 周飞 李志章 罗启富 |
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| 作者单位： | 华东船舶工业学院，浙江大学，江苏理工大学 |
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| 摘 要： | 在１３２３Ｋ和０．１ＭＰａ压应力下用Ｔｉ／Ｎｉ／Ｔｉ多层中间层进行Ｓｉ３Ｎ４陶瓷的部分瞬间液相连接．测定了不同连接时间的接头四点弯曲强度，对连接界面进行了ＳＥＭ，ＥＤＸ和ＸＲＤ分析．结果表明：Ｔｉ和Ｎｉ相互扩散形成的液态合金与Ｓｉ３Ｎ４反应并浸润；液相区等温凝固后，形成Ｓｉ３Ｎ４／反应层／ＮｉＴｉ／Ｎｉ３Ｔｉ／Ｎｉ的过渡层连接；连接时间为７．２ｋｓ时，ＮｉＴｉ层已基本消失．分析了陶瓷部分瞬间液相（ＰＴＬＰ）连接的特征，提出了陶瓷ＰＴＬＰ连接参数优化的模型．
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| 关 键 词： | 陶瓷，氮化硅，连接，中间层，瞬间液相，扩散 |
PARTIAL TRANSIENT LIQUID-PHASE BONDING OF Si 3N 4 WITH Ti/Ni/Ti MULTI_INTERLAYER |
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| Chen Zheng,Zhao Qizhang,Lou Hongqing.PARTIAL TRANSIENT LIQUID-PHASE BONDING OF Si 3N 4 WITH Ti/Ni/Ti MULTI_INTERLAYER[J].Journal of The Chinese Ceramic Society,1998(1). |
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| Authors: | Chen Zheng Zhao Qizhang Lou Hongqing |
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| Abstract: | Partial transient liquid_phase bonding of Si 3N 4 ceramics with Ti/Ni/Ti multi_interlayer was performed at 1323K under the pressure of 0.1MPa. The bonding strength was evaluated by four_point bending tests, and the bonded interface was investigated by SEM, EDX and XRD analyses. It is shown that the liquid alloy formed via the interdiffusion of Ti and Ni reacts with Si 3N 4 and wetted the surface of Si 3N 4.A solid bonding transition layer of Si 3N 4/reaction layer/NiTi/Ni 3Ti/Ni is formed after isothermal solidification of liquid phase. NiTi layer disappears at the bonding time of 7.2ks approximately. The characteristics of PTLP bonding for ceramics are analyzed, and the model of bonding_parameters optimization is proposed. |
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| Keywords: | ceramics silicon nitride bonding interlayer transient liquid phase diffusion |
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