无铅水基热风整平助焊剂的研究

使用水溶性载体、活化剂、抗氧剂、表面活性剂和去离子水,制备出一种无铅水基热风整平助焊剂。探讨组分配比对无铅热风整平焊接后,印制板焊盘、孔上铅锡的饱满度、腐蚀性以及单产率等的影响。结果表明,助焊剂的最佳组成为水溶性载体75%,活化剂1.5%,抗氧剂0.3%,表面活性剂0.01%,其余为去离子水。该助焊剂粘度低、助焊效果好、腐蚀性小、耐高温,可适用于新的无铅焊料体系。

Research in water soluble flux for lead-free HASL

Used water-soluble carrier,active agent,antioxidant,surfactant and deionized water,prepared a water soluble flux for lead-free HASL.The effect of various component amount on PCB bonding pads which were treated by lead-free HASL,the brightness and fullness of lead-tin solder in hole,corrosivity and yield rate were studied.The result showed that the best composition of soldering fluid were water-soluble carrier is 75%,active agent is 1.5%,antioxidant is 1.5%,surfactant is 0.01%,the rest is deionized water.This flux had low-viscosity,good-solderability,non-corrosive and high Temperature,can apply to new lead-free solder.