Highly Integrated Ka-Band Sub-Harmonic Image-Reject Down-Converter MMIC

An integrated compact down-converter monolithic microwave integrated circuit chip is presented. It is designed using anti-parallel diode pair sub-harmonic image reject mixer and RF low noise amplifier. The quasi-lumped circuit components are employed in circuit design for the compact chip size. The conversion gain of the chip is 10–14 dB, image rejection above 20 dBc, and noise figure of 3.5–4.5 dB for the RF frequency of 29–36 GHz. The chip size is as compact as $2.24~{rm mm}^{2}$ on a $100~mu{rm m}$ GaAs substrate thickness.