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MEMS高温温度传感器的研制与测量精度研究
引用本文:邵靖,段力,王强,郑芳芳,谢开成,王云生,陶闻钟,高均超,胡铭楷,张丛春,汪红,丁桂甫. MEMS高温温度传感器的研制与测量精度研究[J]. 传感技术学报, 2017, 30(9). DOI: 10.3969/j.issn.1004-1699.2017.09.009
作者姓名:邵靖  段力  王强  郑芳芳  谢开成  王云生  陶闻钟  高均超  胡铭楷  张丛春  汪红  丁桂甫
作者单位:1. 中国航发商用航空发动机有限责任公司,上海,201108;2. 上海交通大学电子信息与电气工程学院,上海,200240;3. 江苏利达高科特种材料有限公司,江苏 常熟,215506
摘    要:航空发动机智能化及其他机械系统的智能化需要原位集成制造的传感器,为此研制了发动机涡轮叶片原位集成高温传感器.该高温传感器采用MEMS微制造工艺将厚度在微米量级的微小传感器原位集成在航空发动机涡轮叶片表面,利用微技术制造的传感器和标准的热电偶进行了一系列的高温测量试验和一系列细致的高温温度表征测量研究.该微制造工艺攻克了两项技术难关:曲表面的光刻技术和高温绝缘层的制作技术.涡轮叶片表面原位集成的微传感器不仅可以原位测量高达800℃的环境温度,并且具有很高的机械强度,可以承受高达40 g的振动和100 g的冲力.研究还表明,在高温测量环境下,高温测量精度和高温环境下的温度场(高温温度的空间分布与升温时间迟豫)密切相关.由于高温环境温度场的差异,可以产生高达10%的测量本征误差.

关 键 词:传感器  高温测量  MEMS  微制造工艺  软光刻技术  铂金热电阻

Fabrication and High Temperature Characterization by MEMS Embedded Sensor
SHAO Jin,DUAN Li,WANG Qiang,ZHENG Fangfang,XIE Kaicheng,WANG Yunsheng,TAO Wenzhong,GAO Junchao,HU Mingkai,ZHANG Congchun,WANG Hong,DING Guifu. Fabrication and High Temperature Characterization by MEMS Embedded Sensor[J]. Journal of Transduction Technology, 2017, 30(9). DOI: 10.3969/j.issn.1004-1699.2017.09.009
Authors:SHAO Jin  DUAN Li  WANG Qiang  ZHENG Fangfang  XIE Kaicheng  WANG Yunsheng  TAO Wenzhong  GAO Junchao  HU Mingkai  ZHANG Congchun  WANG Hong  DING Guifu
Abstract:An embedded high temperature sensor for intelligent aero-engines and other intelligent mechanical sys-temshave been fabricated and characterized under various high temperature measurements. This high temperature sensor was built directly onto the aero-engine turbine blade surface by MEMS microfabrication technology. There are two main challenges for the sensor fabrication—the high temperature electrical insulation and the curved surface soft photolithography have been successfully resolved in our fabrication process. Our embedded high temperature sensor can measure up to 800 ℃ on the blade surface,and can stand for 40 g shakingand 100 g shocking test. We have conducted a series of delicate high temperature experiments and studied the accuracy and precision for high temper-ature characterization. Results show that temperature field( space distribution and time delay of thetemperature ram-ping) in the high temperature system can cause an intrinsic error for high temperature measurements and can cause up to 10% of intrinsic system error regardless of the accuracy of the sensors being used.
Keywords:sensor  MEMS  embedded fabrication  high temperature measurement  soft photolithography  platinum thermal resistor
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