| 基于MEMS技术的异平面空心金属微针 |
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| 引用本文： | 沈修成 刘景全? 王亚军 郭忠元 芮岳峰. 基于MEMS技术的异平面空心金属微针[J]. 传感技术学报, 2009, 22(2) |
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| 作者姓名： | 沈修成 刘景全? 王亚军 郭忠元 芮岳峰 |
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| 作者单位： | 上海交通大学微纳科学技术研究院,微米/纳米加工技术国家级重点实验室,薄膜与微细技术教育部重点实验室,上海,200240;上海交通大学微纳科学技术研究院,微米/纳米加工技术国家级重点实验室,薄膜与微细技术教育部重点实验室,上海,200240;上海交通大学微纳科学技术研究院,微米/纳米加工技术国家级重点实验室,薄膜与微细技术教育部重点实验室,上海,200240;上海交通大学微纳科学技术研究院,微米/纳米加工技术国家级重点实验室,薄膜与微细技术教育部重点实验室,上海,200240;上海交通大学微纳科学技术研究院,微米/纳米加工技术国家级重点实验室,薄膜与微细技术教育部重点实验室,上海,200240 |
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| 基金项目： | 微米/纳米加工技术国家级重点实验室基金，校国防科技发展基金 |
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| 摘 要： | MEMS微针的一个重要应用是透皮给药.文中提出了一种基于MEMS技术的异平面空心金属微针.该微针首先利用硅(100)面刻蚀技术在硅片上刻蚀出深度为330μm的倒四棱锥,然后采用电镀技术电镀出壁厚为50μm的空心金属倒四棱锥.从背面开出微流道并去除残余硅,就得到了倾斜角度为70.6°的异平面金属空心微针.最后采用ANSYS有限元仿真软件建立微针模型,验证了微针具有足够的强度.
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| 关 键 词： | MEMS 微针 电镀 异平面 药物投送 |
Out-of-plane hollow metallic microneedle based on MEMS technology |
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| SHEN Xiu-cheng,LIU Jing-quan,WANG Ya-jun,GUO Zhong-yuan,RUIYue-feng. Out-of-plane hollow metallic microneedle based on MEMS technology[J]. Journal of Transduction Technology, 2009, 22(2) |
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| Authors: | SHEN Xiu-cheng LIU Jing-quan WANG Ya-jun GUO Zhong-yuan RUIYue-feng |
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| Affiliation: | National Key Laboratory of Nano/Micro Fabrication Technology, Key Laboratory of Thin Film and Microfabrication of Ministry of Education, Institute of Micro and Nano Science and Technology, Shanghai Jiaotong University, Shanghai 200240 |
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| Abstract: | An important application of MEMS microneedle is transdermal delivery. In this paper, an out-of-plane metal microneedle is fabricated based on MEMS technology. An inverse pyramid with the depth of 330 um was first etched on a silicon chip using (100) silicon surface etching technology. Then a hollow metal inverse pyramid with the wall thichness of 50um was fabricated using electroplating technology. From the back side, micro channel was fabriated and then the silicon left was removed. An out-of-plane metal hollow microneedle with an incline angle of 70.6 degrees was obtained. Finally, the model of the microneedle is built by the FEM software ANSYS to validate that the microneedle have enough strength. |
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| Keywords: | MEMS |
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