| 自适应无铅焊料的开发与研究 |
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| 引用本文： | 韦晨,刘永长,韩雅静,沈骏.自适应无铅焊料的开发与研究[J].材料导报,2006,20(3):119-121,131. |
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| 作者姓名： | 韦晨 刘永长 韩雅静 沈骏 |
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| 作者单位： | 天津大学材料科学与工程学院金属材料系,天津,300072;天津大学材料科学与工程学院金属材料系,天津,300072;天津大学材料科学与工程学院金属材料系,天津,300072;天津大学材料科学与工程学院金属材料系,天津,300072 |
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| 基金项目： | 中国科学院资助项目，教育部全国优秀博士学位论文作者专项基金，天津大学校科研和教改项目 |
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| 摘 要： | 可靠性是电子工业发展所面临的最大难题.随着对无铅焊料的深入研究,消除金属间化合物对焊点机械性能的不利影响,及解决由于印刷电路板与电子材料间的热膨胀系数不同所产生的、在热循环过程中出现的热疲劳现象,都是提高可靠性的途径.提出了开发自适应无铅焊料解决上述问题,阐述了制备自适应无铅焊料的可行性,并展望了此种焊料的良好应用前景.
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| 关 键 词： | 无铅焊料 形状记忆 金属间化合物 |
Development and Research of Self-adaptive Lead-free Solders |
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| WEI Chen,LIU Yongchang,HAN Yajing,SHEN Jun.Development and Research of Self-adaptive Lead-free Solders[J].Materials Review,2006,20(3):119-121,131. |
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| Authors: | WEI Chen LIU Yongchang HAN Yajing SHEN Jun |
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| Abstract: | Electronic industry faces a crucial problem of reliability. With deeper insights into the lead-free solders, there are two effective ways for improving its reliability, eliminating the disadvantages for the mechanical properties of the solder joints caused by intermetallic phases and avoiding the thermal fatigue emerged during thermal cycling due to the different coefficients of thermal expansion between the packaged components and the printed circuit board. Here further development of self-adaptive lead-free solders is proposed to solve these problems, and the possible preparation methods and prospect application of self-adaptive lead free solders are summarized as well. |
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| Keywords: | lead-free solder shape memory intermetallics |
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