| 集成表面等离子体共振传感芯片 |
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| 引用本文： | 吴斌,王庆康.集成表面等离子体共振传感芯片[J].微纳电子技术,2007,44(9):885-891. |
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| 作者姓名： | 吴斌 王庆康 |
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| 作者单位： | 上海交通大学,微纳科学技术研究院,薄膜与微细技术教育部重点实验室,微米/纳米加工技术国家级重点实验室,上海,200030 |
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| 基金项目： | 上海市纳米科技专项基金 |
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| 摘 要： | 集成表面等离子体共振传感芯片是表面等离子体共振传感技术和微电子集成制造技术结合的产物。介绍了表面等离子体的共振传感的原理和传统器件;重点介绍了集成表面等离子体传感芯片的发展背景、基本结构、制造工艺,并给出了其在金属传感层、整体结构、传感附着膜三个方面的优化方向;对其未来的发展前景进行了展望。
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| 关 键 词： | 表面等离子体共振 传感芯片 基本结构 制造工艺 优化方向 |
| 文章编号： | 1671-4776（2007）09-0885-07 |
| 修稿时间： | 2007-02-04 |
Integrated Surface Plasmon Resonance Sensing Chip |
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| WU Bin,WANG Qing-kang.Integrated Surface Plasmon Resonance Sensing Chip[J].Micronanoelectronic Technology,2007,44(9):885-891. |
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| Authors: | WU Bin WANG Qing-kang |
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| Affiliation: | National Key Laboratory of Micro/Nano Fabrication Technology, Key Laboratory for Thin Film and Microfabrication Technology of Ministry of Education, Research Institute of Micro/Nano Science and Technology, Shanghai Jiao Tong University, Shanghai 200030, China |
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| Abstract: | Integrated surface plasmon resonance(SPR)sensing chip is a combo of surface plasmon resonance sense technology and micro-electronics fabrication technology.The mechanism of plasmon resonance sensing and some traditional SPR devices were introduced.The development background,basic structures and fabrication techniques of integrated SPR sensing chip were introduced,and several optimizing directions in metal sensing layer,integrated structure and adhesion film were also listed.The development prospect of the SPR sensing chip was discussed. |
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| Keywords: | surface plasmon resonance sensing chip basic structures fabrication technique optimizing directions |
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