Machining,Characterization and Optimization: A Novel Approach for Machining Channels on Silicon Wafer Using Tailor-Made Micro Abrasive Jet Machining |
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Authors: | Tomy Anu Hiremath Somashekhar S |
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Affiliation: | 1.Department of Mechanical Engineering, Indian Institute of Technology Madras, Chennai, Tamil Nadu, 600036, India ; |
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Abstract: | Silicon - Literature reveals that machining a silicon wafer is very arduous due to its high brittle nature and low fracture toughness. Researchers have attempted to machine features on a silicon... |
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