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Machining,Characterization and Optimization: A Novel Approach for Machining Channels on Silicon Wafer Using Tailor-Made Micro Abrasive Jet Machining
Authors:Tomy  Anu  Hiremath  Somashekhar S
Affiliation:1.Department of Mechanical Engineering, Indian Institute of Technology Madras, Chennai, Tamil Nadu, 600036, India
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Abstract:Silicon - Literature reveals that machining a silicon wafer is very arduous due to its high brittle nature and low fracture toughness. Researchers have attempted to machine features on a silicon...
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