微波烧结陶瓷结合剂金刚石砂轮研究

为了提高陶瓷结合剂金刚石砂轮的性能,采用微波烧结技术,通过一系列试验,分析了陶瓷结合剂金刚石砂轮的微波烧结温度、陶瓷结合剂含量和金刚石磨料粒度对其性能的影响。结果表明:微波烧结温度是影响陶瓷结合剂金刚石砂轮性能的最主要因素,远超其余二者;陶瓷结合剂金刚石砂轮试样的洛氏硬度和抗弯强度在740 ℃时达到极大值且气孔率较小,此时洛氏硬度为66 HRB,抗弯强度为76.5 MPa,气孔率为17.8%;由微观组织观察可知陶瓷结合剂金刚石砂轮在740 ℃时可以实现陶瓷结合剂对金刚石磨料的均匀包裹,并且气孔较少。

Study on Microwave Sintering of Ceramic Bonded Diamond Grinding Wheels

In order to improve the performance of ceramic bonded diamond grinding wheels, microwave sintering technology was used, and the effects of microwave sintering temperature, ceramic bond content and diamond abrasive size on the performance of ceramic bonded diamond grinding wheels were analyzed through a series of experiments. The results show that microwave sintering temperature is the most important factor affecting the performance of ceramic bonded diamond grinding wheels, far exceeding the remaining two. The Rockwell hardness and bending strength of ceramic bonded diamond grinding wheel specimen reach great value at 740 ℃ and the porosity is small. The Rockwell hardness is 66 HRB, the bending strength is 76.5 MPa and the porosity is 17.8%. It is observed from the microstructure that the ceramic bonded diamond grinding wheels achieve the uniform encapsulation of diamond abrasive by ceramic bond at 740 ℃, and there are few pores.