| 新型光敏封装胶的研制 |
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| 引用本文： | 郑永军. 新型光敏封装胶的研制[J]. 粘接, 2004, 25(4): 14-16 |
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| 作者姓名： | 郑永军 |
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| 作者单位： | 曲阜师范大学化学系,山东,曲阜,273165 |
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| 摘 要： | 介绍了一种光敏封装胶的制备方法，分析了影响光敏封装胶性能的主要因素。试验表明，该胶具有光学性能好、粘接力强、光固化速度快、收缩率低等优点。可用于耦合器等光纤通讯器件的粘接封装。
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| 关 键 词： | 光敏胶 封装 光固化 光纤通讯器件 |
| 文章编号： | 1001-5922(2004)04-0014-03 |
Study on new photosensitive packaging adhesive |
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| ZHENG Yong-jun. Study on new photosensitive packaging adhesive[J]. Adhesion in China, 2004, 25(4): 14-16 |
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| Authors: | ZHENG Yong-jun |
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| Abstract: | A method of preparing photosensitive packaging adhesive was introduced and the main factors to influence its performances were analyzed. This adhesive has many very good characters such as good optical performance, high adhesion, photocuring rapidly, low volume shrinkage. The adhesive can bond and package all kinds of photoconductive fiber communication apparatus such as coupler et al. |
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| Keywords: | photosensitive adhesive packaging photocuring photoconductive fiber communication apparatus |
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