| 滑石粉化学镀银条件的探讨 |
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| 引用本文： | 裴付宇,陈建勇,张华鹏.滑石粉化学镀银条件的探讨[J].稀有金属材料与工程,2011,40(3):538-542. |
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| 作者姓名： | 裴付宇 陈建勇 张华鹏 |
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| 作者单位： | 浙江理工大学,先进纺织材料与制备技术教育部重点实验室,浙江,杭州,310018 |
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| 基金项目： | 浙江理工大学校启动基金 (0601291-Y) |
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| 摘 要： | 以甲醛为还原剂，采用银氨液滴入还原液的镀液加入方式进行化学镀银法制备导电滑石粉，对滑石粉化学镀银条件进行了研究。探讨了银氨液pH值、硝酸银浓度、甲醛浓度、粉体装载量以及反应时间等因素对滑石粉化学镀银的影响规律。借助FESEM对镀银后滑石粉的表面形貌进行了表征，测试了化学镀银后滑石粉的增重率、压实厘米电阻。在以上分析基础上，得出滑石粉化学镀银的最佳工艺条件为：银氨液pH值11.7，硝酸银10 g/L，甲醛13 mL/L，装载量25 g/L，反应时间60 min，得到的镀银滑石粉的厘米电阻为23.6 Ω×cm
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| 关 键 词： | 滑石粉 化学镀银 导电 增重率 形貌 |
| 收稿时间： | 2010/2/26 0:00:00 |
Study on the Electroless Silver Plating of Talcum Powder |
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| Pei Fuyu,Chen Jianyong and Zhang Huapeng.Study on the Electroless Silver Plating of Talcum Powder[J].Rare Metal Materials and Engineering,2011,40(3):538-542. |
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| Authors: | Pei Fuyu Chen Jianyong and Zhang Huapeng |
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| Affiliation: | Key Laboratory of Advanced Textile Materials and Technology of Preparation, Ministry of Education,Zhejiang Science-Technical University, Hangzhou 310018, China |
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| Abstract: | Talcum powder has potential application in the field of conductive fillers preparation because of its particular structure.The conductive talcum powder was prepared by electroless silver plating with the way of silver ammonic solution dipping into the reduction solution with formaldehyde as reductant.The conditions of electroless silver plating for talcum powder were studied.Effects of pH value of the silver ammonic solution,concentration of the silver nitrate and formaldehyde,loadage of the powder and plat... |
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| Keywords: | talcum powder electroless silver plating conductive filler mass gain rate morphology |
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