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| LED封装材料的研究进展 | |
| 引用本文： | 张保坦,李茹,陈修宁,张帆,刘白玲,王公应,何国锋.LED封装材料的研究进展[J].化工新型材料,2010,38(Z1). |
| 作者姓名： | 张保坦 李茹 陈修宁 张帆 刘白玲 王公应 何国锋 |
| 作者单位： | 1. 常州化学研究所常州市新光源材料与技术重点实验室,常州,213164 2. 常州化学研究所常州市新光源材料与技术重点实验室,常州213164;中科院成都有机化学有限公司,成都61041 3. 常州煜明电子有限公司,常州,213000 |
| 摘 要： | 发光二极管是一类可直接将电能转化为可见光和热等辐射能的发光器件。随着亮度和功率的不断提高,封装材料成为制约LED进入照明领域的关键技术之一。针对LED对封装材料的性能要求,综述了LED封装材料种类、特点及发展现状,并重点介绍了环氧和有机硅材料的应用研究进展。 |
| 关 键 词： | 封装材料 环氧树脂 有机硅 |
Advanced progress of LED encapsulation materials |
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| Zhang Baotan,Li Ru,Chen Xiuning,Zhang Fan,Liu Bailing,Wang Gongying,He Guofeng.Advanced progress of LED encapsulation materials[J].New Chemical Materials,2010,38(Z1). | |
| Authors: | Zhang Baotan Li Ru Chen Xiuning Zhang Fan Liu Bailing Wang Gongying He Guofeng |
| Abstract: | LED is the abbreviation of light emitting diode,which is a kind of semiconductor materials that can transform electfical energy into visible light.With the improvement of LED brightness and efficiency,the perparation of the encapsulation materials become one of the key technology which restrict the LED to enter the lighting field.Hence, this article summarized the types.characteristics and development of LED encapsulation materials aiming at the the performanee requirements of LED packaging materials,especially the epoxy and silicone materials. |
| Keywords: | LED LED encaDsulation materials epoxy resins silicone |
| 本文献已被 CNKI 万方数据 等数据库收录！ | |