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| 时效对Sn-Zn无铅钎料焊点可靠性的影响 | |
| 引用本文： | 胡玉华,薛松柏,杨晶秋,叶焕,顾立勇,顾文华.时效对Sn-Zn无铅钎料焊点可靠性的影响[J].焊接学报,2012,33(3):41-44. |
| 作者姓名： | 胡玉华 薛松柏 杨晶秋 叶焕 顾立勇 顾文华 |
| 作者单位： | 1. 南京航空航天大学材料科学与技术学院,南京,210016 2. 哈尔滨焊接研究所,哈尔滨,150080 3. 常熟市华银焊料有限公司,常熟,215513 |
| 基金项目： | 2010年度江苏省企业研究生工作站资助项目 |
| 摘 要： | 采用扫描电子显微镜及STR-1000微焊点强度仪器,研究了Sn-9Zn-0.06Nd/Cu钎焊接头在150℃时效过程中界面组织形貌和力学性能的变化.结果表明,Sn-9Zn-0.06Nd/Cu接头焊接后的界面生成了较为平坦的金属间化合物层Cu5Zn8,随着时效时间的增加,金属间化合物层不断增厚.经过时效处理,钎料中的稀土元素Nd向界面富集并在界面附近生成了Nd3Sn相,同时微焊点的拉伸力不断减小,当时效720 h后,焊点的拉伸力下降了近50%.时效后焊点断裂方式由韧性断裂向脆性断裂转变. |
| 关 键 词： | 时效 金属间化合物 界面组织 力学性能 |
| 收稿时间： | 2011/12/9 0:00:00 |
Effects of aging treatment on reliability of SnZn soldered joints |
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| HU Yuhu,XUE Songbai,Yang Jingqiu,YE Huan,GU Liyong and GU Wenhua.Effects of aging treatment on reliability of SnZn soldered joints[J].Transactions of The China Welding Institution,2012,33(3):41-44. | |
| Authors: | HU Yuhu XUE Songbai Yang Jingqiu YE Huan GU Liyong and GU Wenhua |
| Affiliation: | 1.School of Materials Science and Technology,Nanjing University of Aeronautics and Astronautics,Nanjing 210016,China;2.Harbin Welding Institute,Harbin 150080,China;3.Changshu Huayin Filler Metals Co.,Ltd.,Changshu 215513,China). |
| Abstract: | The interface morphology and mechanical property of Sn-9Zn-0.06Nd/Cu soldered joints after aging treatment at 150 ℃ were investigated with scanning electronic microscope(SEM) and STR-1000 joint strength tester.The experimental results indicated that a planar Cu5Zn8 intermetallic layer(IMC) formed in the soldered joint interface,whose thickness increased with increasing aging time,and the rare earth element Nd migrated towards the interface and reacted with Sn forming Nd3Sn near the interface.While increasing the aging time,the tensile stress of the Sn-9Zn-0.06Nd/Cu micro-joints decreased,and it even reduced by 50% after aging for 720 h.The fracture mode of the soldered joints turned from ductile fracture before aging treatment to both ductile and brittle fracture after aging for 720 h. |
| Keywords: | aging treatment intermetallic compound interface morphology mechanical property |
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