氨基磺酸盐镀镍的微观织构与硬度

采用氨基磺酸盐镀液电沉积镍层,通过WLI,SEM,XRD和MHT对镀层的三维形貌、微观织构及硬度进行分析。结果表明:在镀液中不含添加剂的情况下,随着阴极电流密度的增加,镀层晶粒细化,但镀层致密性变差且硬度呈近似线性关系降低;镀液中加入适量添加剂后,镀层衍射谱特征和各晶面的择优取向度无明显改变,但在相同阴极电流密度下所得镀层的晶粒更加细小且硬度有所提高。

Microstructure and Hardness of Nickel Coating Plated with Amino Sulfamate Solution

The nickel coating was electrodeposited with amino sulfamate solution,and its three-dimensional morphology,microstructure as well as hardness were analyzed using WLI,SEM,XRD and MHT.The results show that,when the bath contains no additive,the coating grains become fine,but the coating compactness becomes worse and the hardness decreases almost linearly as cathode current density increases.After a proper amount of additive is added,the diffraction spectrum characteristics and preferred orientation degree are not evidently changed,but the coating obtained at the same cathode current density exhibits finer grain as well as higher hardness.