| 工艺参数对印刷线路板表面化学镀镍/置换镀金层性能的影响 |
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| 引用本文： | 刘海萍,毕四富,朱国丽,李宁.工艺参数对印刷线路板表面化学镀镍/置换镀金层性能的影响[J].电镀与环保,2012,32(1):15-18. |
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| 作者姓名： | 刘海萍 毕四富 朱国丽 李宁 |
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| 作者单位： | 哈尔滨工业大学(威海)海洋学院,山东威海,264209 |
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| 基金项目： | 哈尔滨工业大学(威海)研究基金(HIT(wh)XB200802);中央高校基本科研业务费专项资金资助(HIT.NSRIF.2009155) |
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| 摘 要： | 分析了工艺参数(如温度、pH值、沉积时间等)的变化时印刷线路板(PCB)表面化学镀镍/置换镀金层性能的影响。结果表明:工艺参数对镀层性能具有较大影响。在此基础上优化了化学镀镍/置换镀金工艺,获得了性能良好的镍/金镀层。
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| 关 键 词： | 印刷线路板 化学镀镍 置换镀金 工艺参数 |
Effects of Technological Parameters on Properties of Electroless Nickel/Immersion Gold Coating on PCB Surface |
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| LIU Hai-ping
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BI Si-fu
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ZHU Guo-li
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LI Ning.Effects of Technological Parameters on Properties of Electroless Nickel/Immersion Gold Coating on PCB Surface[J].Electroplating & Pollution Control,2012,32(1):15-18. |
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| Authors: | LIU Hai-ping BI Si-fu ZHU Guo-li LI Ning |
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| Affiliation: | (School of the Ocean,Harbin Institute of Technology,Weihai 264209,China) |
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| Abstract: | The effects of technological parameters,such as temperature,pH and deposition time on the properties of electroless nickel and immersion gold coating on printed circuited board(PCB) are discussed.The results show that technological parameters have a great influence on the properties of electroless nickel and immersion gold coating.On this basis,the electroless nickel/immersion gold process is optimized,obtaining a good nickel/gold coating. |
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| Keywords: | printed circuited board electroless nickel immersion gold technological parameter |
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