Adhesive Bonding to Galvanized Steel: II. Substrate Chemistry, Morphology and Bond Failure Analysis

Galvanized substrate morphology, oxide layer chemistry, bond failure modes, failure loci, and bondline corrosion have been investigated for adhesive bonds to galvanized steel. Significant differences in surface morphology were observed between the relatively smooth surfaces of “hot-dipped” substrates and the considerably rougher texture of “electroplated” substrates. The hot-dipped substrates were also chemically heterogeneous, with significant amounts of Al, Mg, Ca, and Pb, in addition to Zn, constituting the surface layer. For electroplated substrates, on the other hand, Zn was the major constituent. It was concluded that, for a given adhesive, low strengths and poor bond durability generally correlated with the minimum surface roughness and maximum chemical heterogeneity of the hot-dipped substrates. Higher strengths, and better durability, on the other hand, were observed for electroplated substrates, which showed the greater roughness, as well as chemically the more uniform surface.

Significantly, ESCA spectroscopy of fracture surfaces of unaged samples established that failure loci for both one and two-part epoxy adhesives included the oxide layer of the substrate. This was true for both hot-dipped, as well as electroplated substrates. For aged samples, scanning electron microscopy and X-ray diffraction analysis of failure surface identified zinc-based corrosion products present in the original bond area.