| 波峰焊接工艺技术的研究 |
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| 引用本文： | 鲜飞. 波峰焊接工艺技术的研究[J]. 电子工业专用设备, 2009, 38(2): 10-14 |
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| 作者姓名： | 鲜飞 |
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| 作者单位： | 烽火通信科技有限公司,湖北,武汉,430073 |
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| 摘 要： | 介绍了波峰焊接技术的原理，以及一种新型波峰焊接技术的特点，与传统波峰焊情况不同，它可以保护表面贴装元件来实现对通孔元件焊接。并分别从焊接前的质量控制、生产工艺材料及工艺参数方面探讨了提高波峰焊质量的有效方法。
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| 关 键 词： | 波峰焊 印制线路板 助焊剂 焊料 工艺参数 |
Study on Process of Wave Soldering |
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| XIAN Fei. Study on Process of Wave Soldering[J]. Equipment for Electronic Products Marufacturing, 2009, 38(2): 10-14 |
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| Authors: | XIAN Fei |
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| Affiliation: | XIAN Fei (Fiberhome Telecommunication Co.,Ltd,Wuhan 430074,China) |
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| Abstract: | Wave soldering is a conventional soldering technology, now it still plays an important role in electronics production. The article introduces theory of wave soldering, at the same time an ad- vanced soldering technology is also mentioned, it allows through-hole components to be soldered, and protects SMT components from the wave, unlike in the case of wave soldering. At last the effective way for improving the quality of wave soldering is discussed in terms of the quality control before sol- dering and the ... |
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| Keywords: | Wave Soldering Printed Circuit Board Soldering Flux Solder Process Parameters |
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