RFID封装中热压头的热分析及优化设计

在RFID封装过程中,热压头工作面温度差异和周边散热过大易导致芯片封装失效。针对该问题,提出基于UG建模与有限元协同仿真设计及优化解决方案,为热压头结构设计、材质选择提供理论依据。根据热分析结果设计热压头,采用红外分析仪进行测量温度分布。结果表明,热压头工作面温度差异明显减小,周边散热显著降低。

Thermal Analysis and Optimization Design in RFID Packages

In the process of RFID tag-package,it probably leads to failure because of the temperature-difference and too large heat emission on the working surface of the thermo-compression bonder.To solve this problem,his paper proposes a solution based on UG modeling and finite element simulation with ANSYS WORKBENCH,and provides theoretical reference for the stricture design and material selection of the thermo-compression bonder.We design a thermo-compression boner on the basis of the thermal analysis results and measure the temperature-difference and the heat emission using a infrared thermometer.The results indicate that the temperature-difference and the heat emission decrease obviously.