| 低共熔点芳胺固化环氧树脂动力学研究 |
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| 引用本文： | 叶炜,王岚,李全步,黄培.低共熔点芳胺固化环氧树脂动力学研究[J].热固性树脂,2006,21(6):25-28. |
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| 作者姓名： | 叶炜 王岚 李全步 黄培 |
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| 作者单位： | 南京工业大学化学化工学院,江苏,南京,210009 |
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| 摘 要： | 采用低熔点的间苯二胺(m-PDA)对新型固化剂长链柔性芳香胺(LCDA)进行物理共混改性,得到了1种低共熔点的芳胺环氧固化剂。n(m-PDA)∶n(LCDA)=1∶1时,混合物具有低共熔温度为50.9℃。研究了该低共熔点芳胺与环氧树脂(E-51)的固化行为,根据Melak方法和Kissinger方法确定了体系的固化动力学模型及固化动力学参数。结果表明:该体系的固化动力学模型符合n级固化反应方程,其表观活化能△E为54.49 kJ/mol,频率因子A为7.28×105和反应级数n为0.813。此外,运用外推法得体系起始固化温度Tgel为110℃,恒温固化温度Tcure为150℃,后处理温度Ttreat为185℃,还对体系的固化工艺进行了探讨。
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| 关 键 词： | 低共熔点 芳香胺 环氧树脂 DSC 固化动力学 |
| 文章编号： | 1002-7432（2006）06-0025-04 |
| 收稿时间： | 2006-04-07 |
| 修稿时间： | 2006-09-18 |
Investigation of curing reaction kinetics of eutectic aromatic amine/epoxy resin system |
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| YE Wei,WANG Lan,LI Quan-bu,HUANG Pei.Investigation of curing reaction kinetics of eutectic aromatic amine/epoxy resin system[J].Thermosetting Resin,2006,21(6):25-28. |
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| Authors: | YE Wei WANG Lan LI Quan-bu HUANG Pei |
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| Abstract: | An eutectic aromatic amine curing agent for epoxy has been obtained by physically eutectic mix of m-phenylene diamine(m-PDA) and long-chain flexible diamine(LCDA),when n(m-PDA)∶n(LCDA)= 1∶1,system had the eutectic temerature as 50.9 ℃.Curing behaviors of LCDA/m-PDA/EP system were studied.The curing kinetic models and kinetic parameters of the system were calculated by Melak and Kissinger methods.Analysis of DSC data indicated that curing kinetic models of the system conformed to n-order curing model.The activation energy of the system was 54.49 kJ/mol,the reaction frequency factor was 7.28×10~5 and the reaction order was 0.813.In addition,the curing process technology was researched.The initial curing temperature T_(gel) was 110 ℃,constant curing temperature T_(cure) was 150 ℃ and final treatment temperature T_(treat) was 185 ℃,all of them were obtained-by extrapolation. |
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| Keywords: | DSC |
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