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Material removal at atomic and close-to-atomic scale by high-energy photon:a case study using atomistic-continuum method
Authors:Hao-Jie An  Jin-Shi Wang  Feng-Zhou Fang
Affiliation:1.State Key Laboratory of Precision Measuring Technology and Instruments, Laboratory of MicroNano Manufacturing Technology (MNMT), Tianjin University, Tianjin, 300072, People's Republic of China;2.Centre of MicroNano Manufacturing Technology (MNMT-Dublin), School of Mechanical and Materials Engineering, University College Dublin, Dublin 4, Ireland
Abstract:Extreme ultraviolet (EUV) light plays an important role in various fields such as material characterization and semiconductor manufacturing. It is also a potential approach in material fabrication at atomic and close-to-atomic scales. However, the material removal mechanism has not yet been fully understood. This paper studies the interaction of a femtosecond EUV pulse with monocrystalline silicon using molecular dynamics (MD) coupled with a two-temperature model (TTM). The photoionization mechanism, an important process occurring at a short wavelength, is introduced to the simulation and the results are compared with those of the traditional model. Dynamical processes including photoionization, atom desorption, and laser-induced shockwave are discussed under various fluencies, and the possibility of single atomic layer removal is explored. Results show that photoionization and the corresponding bond breakage are the main reasons of atom desorption. The method developed can be further employed to investigate the interaction between high-energy photons and the material at moderate fluence.The full text can be downloaded at https://link.springer.com/article/10.1007/s40436-021-00374-x
Keywords:Extreme ultraviolet (EUV)  Molecular dynamics (MD)  Two-temperature model (TTM)  Photoionization  Atomic and close-to-atomic scale manufacturing (ACSM)  
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