| Solid–liquid Interdiffusion Bonding of Cu/Sn/Ni Micro-joints with the Assistance of Temperature Gradient |
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| 作者姓名： | Yanqing Lai Shi Chen Xiaolei Ren Yuanyuan Qiao Ning Zhao |
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| 作者单位： | School of Materials Science and Engineering,Dalian University of Technology |
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| 基金项目： | financially supported by the National Natural Science Foundation of China (No. 52075072);;the Fundamental Research Funds for the Central Universities (No. DUT20JC46); |
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| 摘 要： | A novel solid-liquid interdiffusion(SLID) bonding method with the assistance of temperature gradient(TG) was carried out to bonding Cu and Ni substrates with Sn as interlayer.The element distribution and grain morphology of interfacial intermetallic compound(IMC) in Cu/Sn/Ni micro-joints during both SLID and TG-SLID bonding and in the final Cu/(Cu,Ni)6 Sn5/Ni full IMC micro-joints were analyzed.Under the effect of Cu-Ni cross-interaction,interfacial(Cu,Ni)6 Sn
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| 收稿时间： | 2022-03-13 |
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