硬脆材料切割过程中基于线锯速度的切割力自适应控制

光学玻璃、工程陶瓷以及硅基材料等硬脆材料因其良好的物理性质和化学性质而广泛应用于光学工程及集成电路等高尖端技术领域，但低塑性、高脆性的物理特性会导致其切片在切割过程中易出现效率低和表面质量较差等问题。为提高切片表面质量，建立了金刚石线锯切割过程中线锯速度与切割力的模型，设计最小方差自校正控制器对切割力进行在线实时控制。实验结果表明：所设计的最小方差自校正器能够降低线锯切割系统中切片所受的切割力波动，使切割力趋于稳定；与定参数切割条件下所得的切片进行比较，采用最小方差自校正控制策略切割完成的工件表面形貌较为平整，表面粗糙度值降低约30%.

Self-adaptive Control of Cutting Force Based on Wire Saw Velocity in Cutting Process of Hard and Brittle Materials

Hard and brittle materials, such as optical glass, engineering ceramics, and silicon-based materials, are widely used in high-tech fields, such as optical engineering and integrated circuits, because of their good physical and chemical properties. Their low plasticity and high brittleness lead to low efficiency and poor surface quality during cutting. A model of wire saw velocity and normal cutting force in the cutting process of diamond wire saw is established, and a minimum variance self-tuning controller is designed for controlling the cutting force on-line in real-time. The experimental results show that the minimum variance self-tuning controller can be used to reduce the fluctuation of cutting force on the slice in the wire saw cutting system, and make the cutting force tend to be stable. Compared with the slice cutted under the condition of the constant parameters, the surface of work-piece finished using the minimum variance self-tuning control strategy is relatively smooth, and the surface roughness is decreased by about 30%.