| 中温化学镀镍工艺及添加剂的研究 |
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| 引用本文： | 陈彦彬,刘庆国,陈诗勇,尹春贵.中温化学镀镍工艺及添加剂的研究[J].电镀与涂饰,2000,19(1):39-42. |
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| 作者姓名： | 陈彦彬 刘庆国 陈诗勇 尹春贵 |
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| 作者单位： | 1. 北京科技大学,固体电解质研究室,北京,100083
2. 郑州轻工业学院,化工系,河南,郑州,450002 |
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| 摘 要： | 鉴于目前化学镀镍工艺存在的镀液温度高、能耗大及稳定性差等缺点，提出了一种中温化学镀镍工艺。在正交试验结果的基础上，采用三种汪厍剂组合使用，分别研究了络合剂、组合添加剂、温度及ＰＨ值对镀层沉积速度的影响。结果表明：采用组合添加剂能明显提高镀液的稳定性及沉积速度。
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| 关 键 词： | 化学镀镍 中温 电镀 镀镍 工艺 助剂 |
| 文章编号： | 1001-227X(2000)01-0039-04 |
| 修稿时间： | 1999-10-12 |
Study of electroless nickel plating process and its additive at medium temperature |
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| CHEN Yan-bin,LIU Qing-guo,CHEN Shi-yong,YIN Chun-gui.Study of electroless nickel plating process and its additive at medium temperature[J].Electroplating & Finishing,2000,19(1):39-42. |
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| Authors: | CHEN Yan-bin LIU Qing-guo CHEN Shi-yong YIN Chun-gui |
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| Abstract: | In view of the weaknesses of traditional electroless nickel plating process such as high bath temperature, large energy loss and poor bath stability. An electroless nickel plating process at medium temperature was advanced, combined additive consisting of three additives was adopted. Effects of complexing agent, combined additive, temperature and pH value on deposition rate were studied on the basis of orthogonal tests. The results show that electroless nickel plating process is greatly improved in bath stability and deposition rate by adopting combined additive. |
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| Keywords: | electroless nickel plating medium temperature |
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