免修整柔性金刚石砂轮的磨削性能研究

针对现有超大规模集成电路基板加工中存在的效率低问题，提出一种免除砂带张紧装置，消除砂带横向振动影响，达到柔性砂轮磨削效果的新型砂轮，新型砂结合了砂带磨削加工效率高，发热低的优点及砂轮磨削精度高和设备简单的条件，解决了集成电路基板高效磨削的问题，通过和树脂砂轮的对比实验表明，柔性砂轮对石英基板上仍良好的磨削性能。

Research on Grinding Characteristics of Throw-Away Diamond Wheel

s:In order to obtain high-efficiency in manufacturing ULSI wafers, a new structure diamond wheel is put forward, which is provided with the advantages of abrasive belt grinding process and can be installed on the grinding machine spindle without ancillary facilities substituting for common wheels. To overcome problems of cross vibrations and effects of tension on machine spindle accuracy in belt grinding, the structure of a continuous spring and a air-bag inner the soft wheel is designed. With analyzing errors of wheel and experiment of grinding quartz wafers with the soft wheel and a resinoid bond wheel,several good grinding characteristics for grinding quartz wafers are obtained.