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Ion implantation doping of OMCVD grown GaN
Authors:A. Edwards  Mulpuri V. Rao  B. Molnar  A. E. Wickenden  W. Holland  P. H. Chi
Affiliation:(1) Department of Electrical and Computer Engineering, George MasonUniversity, Fairfax, VA, 22030;(2) Naval Research Laboratory, 20375O Washington, DC;(3) Oak Ridge National Laboratory, 37831 Oak Ridge, TN;(4) National Institute of Standards and Technology, 20899 Gaithersburg, MD
Abstract:Doping by ion implantation using Si, O, Mg, and Ca has been studied in single crystal semi-insulating and n-type GaN grown on a-sapphire substrates. The n-and p-type dopants used in this study are Si and O; Mg and Ca, respectively. Room temperature activation of Si and O donors has been achieved after 1150°C annealing for 120 s. The activation of Mg and Ca acceptors is too low to measure at both room temperature and 300°C. Using higher doses to achieve a measurable p-type conduction increases the amount of damage created by the implantation. Rutherford back scattering measurements on this material indicate that the damage is still present even after the maximum possible heat treatment. Secondary ion mass spectrometry measurements have indicated a redistribution in the measured profiles of Mg due to annealing.
Keywords:Annealing  Gallium nitride  Ion implantation  Rutherford backscattering
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