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Experiment and analysis of the effect of BCB sealing ring flatness on BCB cap transfer packaging |
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| Authors: | Seok Seonho |
| Affiliation: | 1.C2N/CNRS-University Paris-Saclay, Palaiseau, France ; |
| Abstract: | Microsystem Technologies - This paper presents the effect of BCB sealing ring flatness on BCB bonding for wafer-scale BCB cap transfer packaging. BCB sealing ring has shown partial bonding or full... |
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