| MCM基极电测试技术 |
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| 引用本文： | 田东方,李自学.MCM基极电测试技术[J].微电子学与计算机,1998(3). |
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| 作者姓名： | 田东方 李自学 |
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| 作者单位： | 西安徽电子技术研究所，西安710054，西安徽电子技术研究所，西安710054 |
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| 摘 要： | 对于复杂的MCM多层互连基板，电测试是控制成本、确保质量的关键环节。本文简要介绍了探针电阻、电容、电子束、潜在开路缺陷电测试及其测试技术的应用。
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| 关 键 词： | 电测试 潜在开路缺陷 薄膜测试 多层基板 电子束 |
Electrical Test Technology of MCM's Substraies |
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| Tian Dongfang and Li Zixue.Electrical Test Technology of MCM's Substraies[J].Microelectronics & Computer,1998(3). |
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| Authors: | Tian Dongfang and Li Zixue |
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| Abstract: | Fox complex MCM substrates, electrical test is afundamental element of cost control and quality assurance' This paper presents electrical test of MCM substrates which include: probe resistance. capcitance.electron beam. latent open defects and applications ofthe test technologies. |
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| Keywords: | Electrical test Latent open depects Thin film test Multi-layer substrates Electron beam |
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