| CuCr触头材料在真空中的焊接倾向 |
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| 引用本文： | 苗柏和,张艳,何建平,刘国勋,王文斌,李刚,王小军.CuCr触头材料在真空中的焊接倾向[J].电工材料,2010(4):3-8. |
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| 作者姓名： | 苗柏和 张艳 何建平 刘国勋 王文斌 李刚 王小军 |
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| 作者单位： | 北京科技大学;陕西斯瑞工业有限责任公司; |
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| 摘 要： | 将熔铸的Cu-30Cr、Cu-30CrZr、Cu-30CrTe和Cu-30CrZrTe合金以及混粉压制烧结的CuCr25粉末冶金触头材料等五种材料制成的试样,在Gleeble3500热模拟试验机上进行真空扩散焊接试验,随后在热模拟试验机上将试样在室温拉断,测量不同触头材料的焊接结合力和强度;使用光学显微镜和扫描电子显微镜观察焊接试样在室温拉断后的断口表面及纵向焊接界面附近焊接区域的显微组织。结果表明,五种触头材料的焊接结合力和强度从高到低依次为Cu-30CrZr、Cu-30Cr、Cu-30CrZrTe、CuCr25、Cu-30CrTe;这些材料的断口金相显示出不同的断裂机理。据此分析在相同的焊接工艺条件下,影响CuCr触头材料焊接结合力及焊接性的主要因素,并从材料学的角度探讨进一步提高现有CuCr触头材料抗熔焊性能的途径。
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| 关 键 词： | CuCr触头材料 真空扩散焊 焊接结合力 抗焊接性 |
The Welding Tendency of CuCr Contact Materials in Vacuum |
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| MIAO Bai-he,ZHANG Yan,HE Jian-ping,LIU Guo-xun,WANG Wen-bin,LI Gang,WANG Xiao-jun.The Welding Tendency of CuCr Contact Materials in Vacuum[J].Electrical Engineering Materials,2010(4):3-8. |
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| Authors: | MIAO Bai-he ZHANG Yan HE Jian-ping LIU Guo-xun WANG Wen-bin LI Gang WANG Xiao-jun |
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| Affiliation: | MIAO Bai-he1,2,ZHANG Yan1,HE Jian-ping1,LIU Guo-xun1WANG Wen-bin2,LI Gang2,WANG Xiao-jun2(1.University of Science and Technology Beijing,Beijing 100083,China,2.Shaanxi Sirui Industries Ltd.,Xi'an 710077,China) |
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| Abstract: | Diffusion welding tests of vacuum casting Cu-30Cr,Cu-30CrZr,Cu-30CrTe and Cu-30CrZrTe alloy contact materials as well as sintered CuCr25 p/m contact materials were performed in the vacuum chamber of Gleeble 3500,and the joining forces of the welded pairs were measured by tensile test at ambient temperature. Characteristics of fracture surfaces were analyzed by optical microscope and SEM.It shows that the joining force and strength decrease in the order of Cu-30CrZr,Cu-30Cr,Cu-30CrZrTe,CuCr25 and Cu-30CrTe c... |
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| Keywords: | CuCr contact materials diffusion welding joining force of welded specimen pairs anti-welding property |
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