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| 微量硅对Ag—Cu—Pd合金钎焊特性的改进 | |
| 引用本文： | 刘泽光. 微量硅对Ag—Cu—Pd合金钎焊特性的改进[J]. 贵金属, 1997, 18(1): 12-14 |
| 作者姓名： | 刘泽光 |
| 作者单位： | 贵金属研究所 |
| 摘 要： | 研究了０．３０￣１．０ｗｔ％Ｓｉ对Ａｇ－２０Ｃｕ－１５Ｐｄ钎料合金钎焊特性之影响，指出：微量Ｓｉ降低其固相线，液相线温度并使其固－液相线间隔变窄。Ｓｉ的添加还提高了Ａｇ－Ｃｕ－Ｐｄ合金在母材Ｆｅ－Ｎｉ－Ｃｏ上的铺展性。 |
| 关 键 词： | 银基合金 硅 钎焊 焊接性能 |
The Effects of a Small Amounts of Silicon on the Brazing Characteristics of Ag Cu Pd Alloy |
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| Liu Zeguang. The Effects of a Small Amounts of Silicon on the Brazing Characteristics of Ag Cu Pd Alloy[J]. Precious Metals, 1997, 18(1): 12-14 | |
| Authors: | Liu Zeguang |
| Abstract: | |
| Keywords: | Silver base alloys Palladium alloys Silicon additons Melting temperature Spreadability PPAGESStudy of Adsorption of Ag with ACF in AgCl-NaCl Solution $$$$ Shui Chengjing and Lu Yuehua (Institute of Precious Metals Kunming 650221) Abstrac |
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