| 甲基磺酸盐镀锡添加剂研究进展 |
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| 引用本文： | 王腾,安成强,郝建军.甲基磺酸盐镀锡添加剂研究进展[J].电镀与涂饰,2009,28(6). |
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| 作者姓名： | 王腾 安成强 郝建军 |
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| 作者单位： | 沈阳理工大学环境与化学工程学院,辽宁,沈阳,110168 |
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| 摘 要： | 综述了甲基磺酸盐酸性镀锡的发展过程及优点,介绍了不同添加剂(如表面活性剂、抗氧化剂、光亮剂等)在甲基磺酸盐酸性镀锡中的作用,探讨了添加剂在电沉积中作用的机理,对添加剂的应用进行了展望.
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| 关 键 词： | 镀锡 甲基磺酸盐 添加剂 机理 应用 |
Research progress of additives for acid tin plating in methanesulfonate electrolyte |
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| WANG Teng,AN Cheng-qiang,HAO Jian-jun.Research progress of additives for acid tin plating in methanesulfonate electrolyte[J].Electroplating & Finishing,2009,28(6). |
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| Authors: | WANG Teng AN Cheng-qiang HAO Jian-jun |
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| Affiliation: | WANG Teng,AN Cheng-qiang*,HAO Jian-jun School of Environment , Chemical Engineering,Shenyang Ligong University,Shenyang 110168,China |
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| Abstract: | The development and advantages of acid tin plating in methanesulfonate electrolyte were summarized. The functions of different additives,such as surfactant,antioxidant,and brightener,for acid tin plating in methanesulfonate electrolyte were introduced. The action mechanism of different additives in tin electrodeposition was discussed. The application of additives was forecasted. |
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| Keywords: | tin plating methanesulfonate additive mechanism application |
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