| 液体微胶囊复合电沉积铜的研究 |
| |
| 引用本文： | 朱立群,张玮,刘锋. 液体微胶囊复合电沉积铜的研究[J]. 材料保护, 2003, 36(3): 24-26 |
| |
| 作者姓名： | 朱立群 张玮 刘锋 |
| |
| 作者单位： | 北京航空航天大学材料学院应用化学系,北京,100083 |
| |
| 基金项目： | 国家自然科学基金，50171002， |
| |
| 摘 要： | 讨论了用水相分离法制备含有液体微胶囊的技术，并将以有机硅树脂为囊心的液体微胶囊加入到酸性镀铜液中进行复合共沉积，得到了含有液体微胶囊的复合镀铜层，通过对这种镀层的表面，断面形貌和表面成分分析，这种含有液体微胶囊的复合镀铜层得到了证实和确认。
|
| 关 键 词： | 液体微胶囊 复合电沉积 铜 复合镀铜层 镀铜 有机硅树脂 |
| 文章编号： | 1001-1560(2003)03-0024-03 |
Electrodepositing Composite Copper Coating with Liquid Microcapsule |
| |
| ZHU Li-qun,ZHANG Wei,LIU Feng. Electrodepositing Composite Copper Coating with Liquid Microcapsule[J]. Journal of Materials Protection, 2003, 36(3): 24-26 |
| |
| Authors: | ZHU Li-qun ZHANG Wei LIU Feng |
| |
| Abstract: | Preparation method of liquid microcapsule using separation in water phase was discussed. An electrodepositing composite copper coating had been obtained by adding the liquid microcapsule containing orhanosilicon resin in acidic copper bath. The electrodepositing composite copper coating with liquid microcapsule had been confirmed by surface and section micrograph and composition analysis. |
| |
| Keywords: | microcapsule electrodepositing composite copper coating |
| 本文献已被 CNKI 维普 万方数据 等数据库收录！ |
