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低栅漏电的增强型InAlN/GaN MISHEMT
引用本文:顾国栋,蔡勇,冯志红,刘波,曾春红,于国浩,董志华,张宝顺. 低栅漏电的增强型InAlN/GaN MISHEMT[J]. 半导体学报, 2012, 33(6): 064004-3
作者姓名:顾国栋  蔡勇  冯志红  刘波  曾春红  于国浩  董志华  张宝顺
作者单位:Science and Technology on ASIC Laboratory, Hebei Semiconductor Research Institute, Shijiazhuang 050051, China;Suzhou Institute of Nano-Tech and Nano-Bionics, Chinese Academy of Sciences, Suzhou 215123, China;Suzhou Institute of Nano-Tech and Nano-Bionics, Chinese Academy of Sciences, Suzhou 215123, China;Science and Technology on ASIC Laboratory, Hebei Semiconductor Research Institute, Shijiazhuang 050051, China;Science and Technology on ASIC Laboratory, Hebei Semiconductor Research Institute, Shijiazhuang 050051, China;Suzhou Institute of Nano-Tech and Nano-Bionics, Chinese Academy of Sciences, Suzhou 215123, China;Suzhou Institute of Nano-Tech and Nano-Bionics, Chinese Academy of Sciences, Suzhou 215123, China;Suzhou Institute of Nano-Tech and Nano-Bionics, Chinese Academy of Sciences, Suzhou 215123, China;Suzhou Institute of Nano-Tech and Nano-Bionics, Chinese Academy of Sciences, Suzhou 215123, China
基金项目:国家自然科学基金 (No. 10990102, No. 60890192, No. 60876009)
摘    要:中文:本文报道了采用热氧化的技术实现低栅泄漏电的增强型InAlN/GaN MISHEMT。在VDS=5V和VGS=0V时,关态漏极电流达到了10-7A/mm。器件的阈值电压为2.2V。当VDS=5V时,漏极电流在VGS=4.5V时,达到349mA/mm,在VGS=3.4V时,最大跨导为179ms/mm。在当VGS= -15V时候,器件的反向栅泄漏电流达到4.9?10-7A/mm。

关 键 词:漏电流密度  氮化镓    线性外推法  氧化技术  阈值电压  传输特性  栅偏压
修稿时间:2012-01-05

Enhancement-mode InAlN/GaN MISHEMT with low gate leakage current
Gu Guodong,Cai Yong,Feng Zhihong,Liu Bo,Zeng Chunhong,Yu Guohao,Dong Zhihua and Zhang Baoshun. Enhancement-mode InAlN/GaN MISHEMT with low gate leakage current[J]. Chinese Journal of Semiconductors, 2012, 33(6): 064004-3
Authors:Gu Guodong  Cai Yong  Feng Zhihong  Liu Bo  Zeng Chunhong  Yu Guohao  Dong Zhihua  Zhang Baoshun
Affiliation:Science and Technology on ASIC Laboratory, Hebei Semiconductor Research Institute, Shijiazhuang 050051, China;Suzhou Institute of Nano-Tech and Nano-Bionics, Chinese Academy of Sciences, Suzhou 215123, China;Suzhou Institute of Nano-Tech and Nano-Bionics, Chinese Academy of Sciences, Suzhou 215123, China;Science and Technology on ASIC Laboratory, Hebei Semiconductor Research Institute, Shijiazhuang 050051, China;Science and Technology on ASIC Laboratory, Hebei Semiconductor Research Institute, Shijiazhuang 050051, China;Suzhou Institute of Nano-Tech and Nano-Bionics, Chinese Academy of Sciences, Suzhou 215123, China;Suzhou Institute of Nano-Tech and Nano-Bionics, Chinese Academy of Sciences, Suzhou 215123, China;Suzhou Institute of Nano-Tech and Nano-Bionics, Chinese Academy of Sciences, Suzhou 215123, China;Suzhou Institute of Nano-Tech and Nano-Bionics, Chinese Academy of Sciences, Suzhou 215123, China
Abstract:
Keywords:enhancement-mode  InAlN/GaN HEMT  threshold voltage  thermal oxidation  gate leakage
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