石墨粉表面化学置换镀铜研究

以往在石墨粉表面镀铜存在过程复杂、成本高的缺点，为了改变这种状况，采用化学置换镀的方法在石墨粉表面镀铜，观察了镀铜石墨粉的微观形貌，研究了影响化学置换镀铜的主要因素，分析了化学置换镀铜的机理。实验结果表明：在用镀铜石墨粉制备的复合材料中，铜能形成连续的三维网络结构，有利于提高材料的性能；采用铁粉做还原剂时，为了提高镀覆质量，镀液的最佳pH值应为3左右，搅拌速率应控制在40～60r／min，温度应控制在60％左右；与铝、锌相比，铁作还原剂具有镀覆效果好、副反应少、成本低等优点，有利于工业推广。

Study on Plating Copper on the Surface of Graphite Powders by the Method of Chemistry-replacement

Plating copper on the surface of graphite powders had defect of complex process and high cost in the past,in order to change this status,the method of chemistry-replacement to plate copper on the surface of graphite powders was used,the microstructure of copper-coated graphite powders was watched,the main factors of impacting on plating copper by using the method of chemistry-replacement were researched;The principle of plating copper by chemistry-replacement was analyzed.The experimental results showed: Th...