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Microstructure mapping of interconnects by orientation imaging microscopy |
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| Authors: | David P. Field David J. Dingley |
| Affiliation: | (1) TexSEM Laboratories, Inc., 226W 2230N #120, 84604 Provo, UT |
| Abstract: | |
| Keywords: | Interconnect lines Metallization Orientation imaging microsocpy (OIM) Scanning electron microscopy (SEM) |
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