| 碲镉汞线列红外探测器模块温度循环的可靠性 |
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| 引用本文： | 陈星,何凯,王建新,叶振华,林春,张勤耀. 碲镉汞线列红外探测器模块温度循环的可靠性[J]. 红外与毫米波学报, 2014, 33(4): 369-374 |
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| 作者姓名： | 陈星 何凯 王建新 叶振华 林春 张勤耀 |
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| 作者单位： | 1. 中国科学院上海技术物理研究所材料与器件研究中心,上海200083;中国科学院大学,北京100039
2. 中国科学院上海技术物理研究所材料与器件研究中心,上海,200083 |
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| 摘 要： | 针对直接倒焊(Ⅰ型)、间接倒焊(Ⅱ型)两种红外探测器模块,两者中的探测器芯片、硅读出电路和引线基板的尺寸完全相同,只在倒焊封装结构上有所差异,用有限元方法分析比较了这两种封装形式的基本模块于液氮温度时的热应力和形变大小情况,分析结果与实验现象符合较好,模块低温形变值的测量验证了有限元分析结果的合理性.
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| 关 键 词： | 碲镉汞红外探测器 可靠性 热应力 形变 有限元分析 |
| 收稿时间： | 2013-03-19 |
| 修稿时间： | 2014-06-02 |
Thermal cycling reliability of linear HgCdTe infrared detectors |
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| CHEN Xing,HE Kai,WANG Jian-Xin,YE Zhen-Hu,LIN Chun and ZHANG Qin-Yao. Thermal cycling reliability of linear HgCdTe infrared detectors[J]. Journal of Infrared and Millimeter Waves, 2014, 33(4): 369-374 |
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| Authors: | CHEN Xing HE Kai WANG Jian-Xin YE Zhen-Hu LIN Chun ZHANG Qin-Yao |
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| Affiliation: | Key Laboratory of Infrared Imaging Materials and Devices, Shanghai Institute of Technical Physics, Chinese Academy of Sciences,Key Laboratory of Infrared Imaging Materials and Devices, Shanghai Institute of Technical Physics, Chinese Academy of Sciences,Key Laboratory of Infrared Imaging Materials and Devices, Shanghai Institute of Technical Physics, Chinese Academy of Sciences,Key Laboratory of Infrared Imaging Materials and Devices, Shanghai Institute of Technical Physics, Chinese Academy of Sciences,Key Laboratory of Infrared Imaging Materials and Devices, Shanghai Institute of Technical Physics, Chinese Academy of Sciences and Key Laboratory of Infrared Imaging Materials and Devices, Shanghai Institute of Technical Physics, Chinese Academy of Sciences |
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| Abstract: | |
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| Keywords: | HgCdTe infrared detector reliability thermal stress warpage finite element analysis |
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