| Sn-8Zn无铅钎料性能的研究 |
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| 引用本文： | 商延赓,郎波,孙大千,吴文云,黄泽武.Sn-8Zn无铅钎料性能的研究[J].电子工艺技术,2006,27(4):197-200. |
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| 作者姓名： | 商延赓 郎波 孙大千 吴文云 黄泽武 |
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| 作者单位： | 吉林大学,吉林,长春,130025;吉林大学,吉林,长春,130025;吉林大学,吉林,长春,130025;吉林大学,吉林,长春,130025;吉林大学,吉林,长春,130025 |
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| 摘 要： | 研究了不同微量合金元素(Bi、Ag)对Sn-8Zn无铅钎料高温抗氧化性能及接头剪切强度的影响,采用氧化质量增加△m值的方法,在高温下观察钎料表面氧化膜形状和颜色的变化并对氧化膜进行X射线衍射分析,探讨了钎料的高温抗氧化性能的机理,通过对钎料的金相显微组织观察和对热处理后钎焊接头的剪切强度试验,分析了提高接头剪切强度的原因.试验结果表明:在Sn-8Zn钎料中加入适量的合金元素(Bi、Ag)均可以改善和提高钎料的高温抗氧化性能和接头的剪切强度.
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| 关 键 词： | 无铅钎料 抗氧化性 剪切强度 热处理 |
| 文章编号： | 1001-3474（2006）04-0197-04 |
| 收稿时间： | 2006-05-10 |
| 修稿时间： | 2006年5月10日 |
Study of Sn-8Zn Lead-free Solder Weldability |
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| SHANG Yan-geng,LANG Bo,SUN Da-qian,WU Wen-yun,HUANG Ze-wu.Study of Sn-8Zn Lead-free Solder Weldability[J].Electronics Process Technology,2006,27(4):197-200. |
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| Authors: | SHANG Yan-geng LANG Bo SUN Da-qian WU Wen-yun HUANG Ze-wu |
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| Affiliation: | JiLin University, Changchun 130022, China |
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| Abstract: | The effects of alloy elements Bi and Ag on the resistance to oxidability and joint shear strength of Sn -8Zn lead -free solder at high -temperature was studied. At high -temperature the change of oxidation film shape and color was observed on the surface of liquid solder by oxidation weight increase A M value method. We analyzed oxidation film by X - ray diffraction analysis and studied high - temperature resistance to oxidability of solder. The reasons of advancing observations of solder structure and joint shear strength were analyzed by experiments of solder joint shear strength after heat treatment. The experimental results indicated that the appropriate addition of alloy elements Bi and Ag could enhance resistance to oxidability at high -temperature and joint shear strength. |
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| Keywords: | Lead-free solder Resistance to oxidability Shear strength Heat treatment |
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