| 基于HSCAE的电器外壳注射模优化设计 |
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| 引用本文： | 袁飞.基于HSCAE的电器外壳注射模优化设计[J].模具工业,2014(8):46-49. |
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| 作者姓名： | 袁飞 |
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| 作者单位： | 常州轻工职业技术学院,江苏常州213164 |
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| 摘 要： | 采用HSCAE软件对电器外壳的注射成型过程进行了模拟,分析了塑件翘曲变形的原因并提出了改进措施,对塑件成型工艺进行了优化,提高了塑件成型质量和生产效率,为类似塑件的注射模设计提供了理论依据。
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| 关 键 词： | 注射模 翘曲 模流分析 工艺参数 HSCAE |
HSCAE-based optimization design of injection mould for electrical apparatus shell |
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| YUAN Fei.HSCAE-based optimization design of injection mould for electrical apparatus shell[J].Die & Mould Industry,2014(8):46-49. |
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| Authors: | YUAN Fei |
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| Affiliation: | YUAN Fei (Changzhou Institute of Light Industry Technology, Changzhou, Jiangsu 213164, China) |
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| Abstract: | The injection moulding process for an electrical apparatus shell was simulated by using the HSCAE software. The cause of the shell warpage was analyzed and the improvement measures were proposed. Then the moulding process was optimized. |
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| Keywords: | injection mould warpage mould flow analysis process parameters HSCAE |
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