| Ni-Cu-P合金显微组织和硬度的研究 |
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| 引用本文： | 陈平昌,林汉同.Ni-Cu-P合金显微组织和硬度的研究[J].特种铸造及有色合金,2000(5):23-24. |
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| 作者姓名： | 陈平昌 林汉同 |
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| 作者单位： | 华中科技大学 |
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| 摘 要： | 熔制的Ｎｉ－Ｃｕ－Ｐ合金显微组织由Ｎｉ－Ｃｕ，Ｃｕ－Ｎｉ两种固溶体枝晶和弥散其中的Ｎｉ３Ｐ组成。随着磷含量的增加，Ｎｉ－Ｃｕ－Ｐ合金的硬度显著提高。热处理对Ｎｉ－Ｃｕ－Ｐ合金的显微组织和硬度无显著影响。
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| 关 键 词： | 熔制 Ni－Cu－P合金 显微组织 硬度 化学镀 |
| 修稿时间： | 2000-04-09 |
Study on Microstructure and Hardness of Ni-Cu-P Alloy |
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| Chen Pingchang,Lin Hantong.Study on Microstructure and Hardness of Ni-Cu-P Alloy[J].Special Casting & Nonferrous Alloys,2000(5):23-24. |
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| Authors: | Chen Pingchang Lin Hantong |
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| Abstract: | Microstructure of smelting prepared Ni Cu P alloy consists of Ni Cu and Cu Ni solid solution dendrites and Ni 3P dispersed particles between them. The hardness of Ni Cu P alloy is raised remarkably with the increase of P addition. Heat treatment has no obvious effect on microstructure and hardness of Ni Cu P alloy. |
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| Keywords: | Smelting Preparation Ni Cu P Alloy Microstructure Hardness |
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