| 多芯片组件散热的三维有限元分析 |
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| 引用本文： | 程迎军,罗乐,蒋玉齐,杜茂华.多芯片组件散热的三维有限元分析[J].电子元件与材料,2004,23(5):43-45. |
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| 作者姓名： | 程迎军 罗乐 蒋玉齐 杜茂华 |
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| 作者单位： | 中科院上海微系统与信息技术研究所,传感技术国家联合重点实验室,上海,200050;中科院上海微系统与信息技术研究所,传感技术国家联合重点实验室,上海,200050;中科院上海微系统与信息技术研究所,传感技术国家联合重点实验室,上海,200050;中科院上海微系统与信息技术研究所,传感技术国家联合重点实验室,上海,200050 |
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| 基金项目： | 中科院知识创新工程重大项目 |
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| 摘 要： | 基于有限元法的数值模拟技术是多芯片组件(Multichip Module)热设计的重要工具。采用有限元软件ANSYS建立了一种用于某种特殊场合的MCM的三维热模型,对空气自然对流情况下,MCM模型的温度分布和散热状况进行了模拟计算。并定量分析了空气强迫对流和热沉两种热增强手段对MCM模型温度分布和散热状况的影响。研究结果为MCM的热设计提供了重要的理论依据。
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| 关 键 词： | 多芯片组件 热设计 有限元法 |
| 文章编号： | 1001-2028(2004)05-0043-03 |
Three Dimensional Finite Element Analysis of Heat Dissipation of Multichip Module |
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| CHENG Ying-jun,LUO Le,JIANG Yu-qi,DU Mao-hua.Three Dimensional Finite Element Analysis of Heat Dissipation of Multichip Module[J].Electronic Components & Materials,2004,23(5):43-45. |
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| Authors: | CHENG Ying-jun LUO Le JIANG Yu-qi DU Mao-hua |
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| Affiliation: | CHENG Ying-jun,LUO Le,JIANG Yu-qi,DU Mao-hua Shanghai Institute of Microsystem and Information Technology,The Chinese Academy of Science,State Key Laboratories of Transducer Technology,Shanghai 20050,China |
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| Abstract: | Numerical simulation based on finite element method is an important tool in the thermal analysis of multichip
module(MCM). A three dimensional thermal model of a kind of MCM for special use was builted with ANSYS to calculate the
temperature distribution and power dissipation under air free convection condition. The effect of thermal enhancements such as
air forced convection and heat sink on temperature distribution and power dissipation of MCM was analyzed quantitatively.
The simulated results provide a theoretical basis for thermal design of MCM. |
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| Keywords: | MCM thermal design finite element method |
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