The determination of three-dimensional stress tensors on multilayer thin films |
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Authors: | M. D. Yeager C. O. Ruud P. C. Chen |
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Affiliation: | (1) Pennsylvania Power and Light Company, Two North Ninth Street, 18101 Allentown, Pennsylvania;(2) Industrial and Management Systems Engineering, The Pennsylvania State University, 16802 University Park, Pennsylvania;(3) Systems Technology Division, IBM Corporation, 13760 Endicott, New York |
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Abstract: | The three-dimensional residual stress condition of copper sputtered on Kapton films was studied by two nondestructive x-ray diffraction techniques. Four samples were evaluated—one control sample, and three heat-treated samples. Because of concerns about steep stress gradients normal to the specimen surface, an experimental technique described by Dölle(1) was used to obtain the residual strain tensors in the near surface region. The resulting stress tensors were compared to data obtained through a modification of the technique described by Dölle, referred to as the differential method.(2) |
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Keywords: | X-ray diffraction tensors nondestructive evaluation residual stress |
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