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Thin film encapsulation of DSSCs on plastic substrate
Authors:L.-T. Huang  M.-L. Chang  H.-C. Lin
Affiliation:a Department of Materials Science and Engineering, National Taiwan University, Taipei, Taiwan
b Department of Materials Engineering, National Chung Hsing University, Taichung, Taiwan
c Department of Product Development, Taiwan Textile Research Institute, Taipei, Taiwan
Abstract:Aluminum oxynitride (AlOxNy) films were deposited on polyethylene naphthalate (PEN) substrates using a reactive radio frequency (RF) magnetron sputtering system by varying the nitrogen flow rate. Experimental results show that the AlOxNy films deposited on PEN substrate exhibit a pebble-like surface morphology. The deposition rate decreases slightly upon increasing the nitrogen flow rate. The surface roughness of the deposited AlOxNy films also decreases upon increasing the nitrogen flow rate. The AlOxNy film deposited at a nitrogen flow rate of 15 sccm exhibited the lowest water vapor transmission rate of 0.02 g/m2·day. Meanwhile, the passivation of AlOxNy films can effectively improve the long-term stability of plastic DSSC. Their power conversion efficiency can sustain 50% of the initial values even after 300 h.
Keywords:Aluminum oxynitride film   Reactive magnetron sputtering   Polyethylene naphthalate   Dye-sensitized solar cells   Gas permeation
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