| 氰酸酯树脂在高性能印刷电路板中的应用概况 |
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| 引用本文： | 曾志安,陈立新,唐玉生.氰酸酯树脂在高性能印刷电路板中的应用概况[J].中国塑料,2003,17(5):19-23. |
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| 作者姓名： | 曾志安 陈立新 唐玉生 |
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| 作者单位： | 西北工业大学化工系 陕西西安710072
(曾志安，陈立新)，西北工业大学化工系 陕西西安710072(唐玉生) |
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| 摘 要： | 综述了氰酸酯树脂及氰酸酯改性环氧树脂在高性能印刷电路板中的应用。论述了氰酸酯改性环氧树脂的机理与性能。以改性树脂基体制备的覆铜板介电性能明显得到提高，能满足高频使用的条件。
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| 关 键 词： | 氰酸酯树脂 环氧树脂 印刷电路板 介电性能 |
A Review of Applications of Cyanate Resin in High Performance PCB |
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| ZENG Zhi an,CHEN Li xin,TANG Yu sheng.A Review of Applications of Cyanate Resin in High Performance PCB[J].China Plastics,2003,17(5):19-23. |
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| Authors: | ZENG Zhi an CHEN Li xin TANG Yu sheng |
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| Abstract: | Application of cyanate ester resin(CE)and CE modified epoxy in high performance printed circuit board(PCB) is reviewed.The mechanism of modification of CE on epoxy and properties of CE modified epoxy are discussed. The dielectric performance of copper claded board made from the modified epoxy is enchanced remarkably and can meet the high frequency requirements. |
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| Keywords: | cyanate ester resin epoxy resin printed circuit board dielectric performance |
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