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闭合场非平衡磁控溅射离子镀复合金属镀层在PCB微钻中的应用
引用本文:种艳琳,李小泉.闭合场非平衡磁控溅射离子镀复合金属镀层在PCB微钻中的应用[J].印制电路信息,2006(4):35-39.
作者姓名:种艳琳  李小泉
作者单位:1. 西安理工大学材料科学与工程学院,7100048
2. 东莞秦人科技有限公司
摘    要:采用闭合场非平衡磁控溅射离子镀技术在PCB微钻上进行复合金属镀层处理,通过与无镀层微钻进行钻削试验对比,结果表明:复合金属镀层微钻使用寿命与未镀层微钻相比,可提高4倍;具有纳米结构的高硬度复合金属镀层显著提高了微钻的耐磨性。

关 键 词:闭合场非平衡磁控溅射离子镀  复合金属镀层  PCB微钻

Application of Multiple Metal Coating of Closed Field Unbalanced Magnetron Sputter Ion Plating in PCB Micro-drill
Zhong Yanlin,Li Xiaoquan.Application of Multiple Metal Coating of Closed Field Unbalanced Magnetron Sputter Ion Plating in PCB Micro-drill[J].Printed Circuit Information,2006(4):35-39.
Authors:Zhong Yanlin  Li Xiaoquan
Affiliation:Zhong Yanlin Li Xiaoquan
Abstract:The closed field unbalanced magnetron sputter ion plating has been introduced on the PCB micro-drill.The result showed that multiple metal film and a high hardness transitive layer can raise greatly the wear resistance andhardness of micro-drill. Which can benefit the life of multiple metal coated micro-drill 4 times higher than that of originalmicro-drill. This article focus on introduce this technology and advantages.
Keywords:closed field unbalanced magnetron sputter ion plating multiple metal coatingPCB micro-drill
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